Rigid-Flex PCB boards
Shanxu Pcb manufactured many rigid-flex Printed Circuit Boards for our clients to meet their design requirements, pcb design and fabrication of rigid flex circuit boards,saving the internal space of products, reducing the volume of finished products and improving the performance of products. This kind of rigid-flex PCB boards also can be manufactured with blind & buried via, epoxy resin or copper filled via, Controlled Impedance process as well.
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Shanxu Pcb manufactured many rigid-flex Printed Circuit Boards for our clients to meet their design requirements, pcb design and fabrication of rigid flex circuit boards,saving the internal space of products, reducing the volume of finished products and improving the performance of products. This kind of rigid-flex PCB boards also can be manufactured with blind & buried via, epoxy resin or copper filled via, Controlled Impedance process as well.
| Rigid-Flex PCB Capability | |||
| Category | Item | English | Metric |
| Laminates | Max. Number of Layers | 16 L (R+F) | 16 L (R+F) |
| Min. Finished Board Thickness | 0.01" | 0.3 mm | |
| Max. Finished Board Thickness | 0.062" | 1.6 mm | |
| Finished Board Thickness Tolerance | ± 10% | ± 10% | |
| Max. Panel Size | 19.68" * 19.68" | 500 * 500 mm | |
| Copper | Max. Inner Layer Copper Thickness | 2 oz | 0.07 mm |
| Max. Outer Layer Copper Thickness | 3 oz | 0.105 mm | |
| Trace | Min. Inner Layer Line Width | 2 mil | 0.05 mm |
| Min. Inner Layer Line Spacing | 2 mil | 0.05 mm | |
| Min. Outer Layer Line Width | 2 mil | 0.05 mm | |
| Min. Outer Layer Line Spacing | 2 mil | 0.05 mm | |
| Min. BGA Pitch | 13.7 mil | 0.35 mm | |
| Min. BGA Pad | 8 mil | 0.2 mm | |
| Holes | Hole Position Tolerance | ± 3 mil | ± 0.075 mm |
| Hole Size Tolerance(PTH) | ± 3 mil | ± 0.075 mm | |
| Hole Size Tolerance(NPTH) | ± 2 mil | ± 0.05 mm | |
| Min. Plated Slot | 15.7 mil | 0.4 mm | |
| Min. Non-Plated Slot | 15.7 mil | 0.4 mm | |
| Drill | Min. Mechanical Drill Hole Size | 6 mil | 0.15 mm |
| Min. Laser Drill Hole Size | 3 mil | 0.075 mm | |
| Max. Mechanical Drill Hole Size | 256 mil | 6.5 mm | |
| Aspect Ratio | 12:1 | 12:1 | |
| Gold Finger | Angle of Beveling | 15-45° | 15-45° |
| Angle of Beveling Tolerance | ± 3° | ± 3° | |
| Depth of Beveling | ≥ 4 mil | ≥ 0.1 | |
| Depth of BevelingTolerance | ± 3 mil | ± 0.075 mm | |
| Profile | V-Cut Position Tolerance | ± 3 mil | ± 0.075 mm |
| CNC Tolerance | ± 4 mil | ± 0.1 mm | |
| Stamping Tolerance | ± 4 mil | ± 0.1 mm | |
| Special Process | Controlled Impedance Tolerance | ± 3% | ± 3% |
| Min. Pad with Via | 7 mil | 0.175 mm | |
| Blind and Buried Via | 3+N+3 | 3+N+3 | |
| Plugged Via | Resin Filled or Conductive Filled | ||
| Color of Solder Mask | Green | Matte Green | Light Green |
| Black | Matte Black | Red | |
| Yellow | White | Blue | |
| Color of Silk Screen | White | Black | Yellow |
| Green | Red | Blue | |
| Surface Finishing | HASL | HASL Lead Free | Immersion Silver |
| Immersion Gold (ENIG) | Gold Finger (Hard Gold) | Immersion Tin | |
| PCB Material | FR-4 (SHENGYI) | High TG FR-4 (SHENGYI) | PI (Panasonic) |
| PTFE(Rogers) | PTFE(Arlon) | PTFE(Tuc) | |
