Multi-layers Rigid PCB Boards
Shanxu Pcb manufactured many multi-layers Printed Circuit Boards for our clients to meet their design requirements, pcb design and fabrication of rigid flex circuit boards,saving the internal space of products, reducing the volume of finished products and improving the performance of products. This kind of rigid-flex PCB boards also can be manufactured with blind & buried via, epoxy resin or copper filled via, Controlled Impedance process as well.
Description
Package Information
Inquiry
How to get quotation for PCB Fabrication
Please prepare following info and send it to us, our salesman will send the quotation file to you within 24 hours. 1.PCB design file (gerber file )
2.Quantity
3.Material of printed circuit fabrication
4.Finished Thickness
5.Copper Thickness
6.Surface Finishing
7.Color of Silkscreen
8.Color of Solder Mask
| Rigid PCB Capability | |||
| Category | Item | English | Metric |
| Laminates | Max. Number of Layers | 40 L | 40 L |
| Min. Finished Board Thickness | 0.008" | 0.2 mm | |
| Max. Finished Board Thickness | 0.248" | 6.3 mm | |
| Finished Board Thickness Tolerance | ± 10% | ± 10% | |
| Max. Panel Size | 23" * 40" | 584 * 1016 mm | |
| Copper | Max. Inner Layer Copper Thickness | 6 oz | 0.21 mm |
| Max. Outer Layer Copper Thickness | 6 oz | 0.21 mm | |
| Trace | Min. Inner Layer Line Width | 3 mil | 0.075 mm |
| Min. Inner Layer Line Spacing | 3 mil | 0.075 mm | |
| Min. Outer Layer Line Width | 3 mil | 0.075 mm | |
| Min. Outer Layer Line Spacing | 3 mil | 0.075 mm | |
| Min. BGA Pad | 8 mil | 0.2 mm | |
| Holes | Hole Position Tolerance | ± 3 mil | ± 0.075 mm |
| Hole Size Tolerance(PTH) | ± 3 mil | ± 0.075 mm | |
| Hole Size Tolerance(NPTH) | ± 2 mil | ± 0.05 mm | |
| Min. Plated Slot | 15.7 mil | 0.4 mm | |
| Min. Non-Plated Slot | 15.7 mil | 0.4 mm | |
| Drill | Min. Mechanical Drill Hole Size | 6 mil | 0.15 mm |
| Min. Laser Drill Hole Size | 3 mil | 0.075 mm | |
| Max. Mechanical Drill Hole Size | 256 mil | 6.5 mm | |
| Aspect Ratio | 12:1 | 12:1 | |
| Gold Finger | Angle of Beveling | 15-45° | 15-45° |
| Angle of Beveling Tolerance | ± 5° | ± 5° | |
| Depth of Beveling | ≥ 4 mil | ≥ 0.1 | |
| Depth of BevelingTolerance | ± 3 mil | ± 0.075 mm | |
| Profile | V-Cut Position Tolerance | ± 3 mil | ± 0.075 mm |
| CNC Tolerance | ± 2 mil | ± 0.05 mm | |
| Stamping Tolerance | ± 4 mil | ± 0.1 mm | |
| Special Process | Controlled Impedance Tolerance | ± 3% | ± 3% |
| Min. Pad with Via | 7 mil | 0.175 mm | |
| Blind and Buried Via | 3+N+3 | 3+N+3 | |
| Plugged Via | Resin Filled or Conductive Filled | ||
| Color of Solder Mask | Green | Matte Green | Light Green |
| Black | Matte Black | Red | |
| Yellow | White | Blue | |
| Color of Silk Screen | White | Black | Yellow |
| Green | Red | Blue | |
| Surface Finishing | HASL | HASL Lead Free | OSP |
| Immersion Gold (ENIG) | Gold Finger (Hard Gold) | Solf Gold (for COB) | |
| Immersion Silver | Immersion Tin | Carbon Ink | |
| PCB Material | FR-4 | High TG FR-4 | PTFE |
| Halogen-Free | Ceramic | Composite Material | |
| Aluminum Base | Copper Base | Others as Requested | |
